Bernstein Wafer Tweezer 6 mm Jaw With Graduated Lower Paddle and 3 Teeth 3 DWF Small discount_WIHA non-condensing (< 10°C) ≤90% RH

non-condensing (< 10°C) ≤90% RH (at 10 °C to 30 °C) ≤75% RH (at 30 °C to 40 °C) ≤45% RH (at 40 °C to 50 °C) Operating altitude 2000 m Storage altitude 12

beginning with SmartHeat® technology that senses the thermal load and instantly delivers power on demand to the solder joint

The is capable of being clamped on current conductors up to 15mm in diameter

safety guard and side handle

Adapter available to connect magnetic ground end to standard banana jack

Bernstein Wafer Tweezer 6 mm Jaw With Graduated Lower Paddle and 3 Teeth 3 DWF Small discount_WIHA non-condensing (< 10°C) ≤90% RHOverview For positioning of flat and fine components, e. g. extremely sensitive and breakable wafer (Glass wafer etc.) fine PCB's and LCD's very smooth and non reflective surface high grade steel SA, anti magnetic. Specifications Brand Bernstein Product Type Wafer Tweezer Length 130 mm Weight 14 g Special Features With graduated lower paddle and 3 teeth 3 DWF small For Wafer Size 2 in Jaw Size 6 mm Resources Product Brochure